2-Layer Double-Sided Flexible Copper-Clad Laminate(Cu18μm/TPI25μm/Cu18μm x 9.8in)-5m-High Conductivity & Flexibility, Wearable Devices, and Automotive Electronics, 5G Circuit Board (1, 5m)

★★★★★ 4.4 108 reviews

US$36.00
Price when purchased online
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US$36.00
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Free shipping Free 30-day returns

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Product details

Management number 221494543 Release Date 2026/05/03 List Price US$36.00 Model Number 221494543
Category
  • Exceptional Performance: Featuring a robust construction of 18μm copper (Cu) combined with a 25μm Thermal Paper Insulation (TPI) layer, our Copper Clad Laminate ensures unparalleled performance for various applications, particularly in 5G technologies.
  • Versatile Size: Measuring 250mm x 5m, this laminate offers generous material for a wide range of projects, making it the perfect choice for electronics, wearable devices, automotive electronics, and advanced 5G circuit board applications.
  • Superior Conductivity: With its outstanding conductivity and flexibility, our Copper Clad Laminate enables intricate designs and enhances functionality, catering to the evolving demands of cutting-edge technology and high-performance applications.
  • Ideal for High-Tech Projects: Whether developing next-generation wearable devices or automotive components, this flexible laminate is engineered to meet the rigorous standards of modern technological applications, ensuring reliability and durability.
  • Specification: Measuring 250mm x 5m, 18μm copper (Cu), 25μm Thermal Paper Insulation (TPI), One roll per box
Color Copper
Material Cu
Item Form Cu
Brand Name CIVEN METAL
Item Shape Roll
Part Number Copper-Clad Laminate
Manufacturer CIVEN METAL
Item Thickness 0.06 Millimeters
Number of Items 1

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4.4 out of 5
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108 ratings | 44 reviews
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